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Characterization (link to Processing Techniques)
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Metallization (link to Processing Techniques)
Oxidation and Annealing (link to Processing Techniques)
Photolithography (link to Processing Techniques)
Wet Chemical Processing (link to Processing Techniques)
Equipment
Equipment Name Table
Characterization (link to Processing Techniques)
CVD (link to Processing Techniques)
Doping (link to Processing Techniques)
Dry Etch (link to Processing Techniques)
Metallization (link to Processing Techniques)
Oxidation and Annealing (link to Processing Techniques)
Photolithography (link to Processing Techniques)
Wet Chemical Processing (link to Processing Techniques)
HMDS Vapor Prime Oven, YES2 (yes2)
Cleanliness:
All
Processing Technique(s)
Photolithography
>
Wafer preparation before resist
>
Wafer Prime (HMDS)
Capabilities and Specifications
Lithography Specifications
Developer:
HMDS
Process Temperature Range:
150 ºC
Maximum Load:
25
Notes:
Singe and prime. No Resist allowed!
Lab Organization, Location, and NEMO Information
Lab Organization:
(SNF Exfab)
Location:
SNF Exfab Paul G Allen 104 Stinson
NEMO Area:
nSiL: L104 Stinson
NEMO ID:
yes2
Training and Maintenance
Lab Facility:
SNF Exfab
Training Charges:
0.00 hours
Primary Trainer:
Swaroop Kommera
Backup Trainer(s):
Cliff Knollenberg
Uli Thumser
Primary Maintenance:
Gary Sosa
Backup Maintenance:
Mario Vilanova
Steps to become a tool user
Become a
member of SNF
.
"All Litho" class is required before training on any of the lithography tools. Please send an email to
all-litho-training@lists.stanford.edu
to sign up for the All Litho class. Read more here:
All Litho class
.
Contact the primary trainer:
Swaroop Kommera