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Thermal ALD

Our thermal ALD systems primarily use DI water as a co-reactant with the metal-organic precursor to deposit films. In practice, these chambers are often used for low temperature depositions since the cooling time is much shorter than the PE-ALD tools.

A couple of useful links that help navigate ALD research in general (not specific to the SNF) are: 

  • a website created by Dr. Mark Sowa that has a survey of plasma ALD literature
  • a website created by Professor Erwin Kessels, Eindhoven University, that provides a dynamic discussion of the ALD landscape.

Technique Tabs

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