Fab Project Courses: E241 & EE412
E241 is a project course focused on developing processes for the SNF nanolabs, a shared facility that supports flexible lithography, heterogeneous integration, and rapid micro prototyping. Team projects are approved by the instructor and are mentored by an ExFab staff member. EE412 is a project-based course focused on the development or characterization of processing methods used for the fabrication of devices in the Stanford Nanofabrication Facility (SNF). The SNF is a shared-use cleanroom providing micro- and nano- fabrication equipment and processing know-how for a diverse range of research areas. In this course, students can choose among several available projects or propose their own, with the objective of gaining experience in the practical aspects of process development and experimental design while contributing to SNF's library of processing methods.
In the last iteration of the E241, we added what we are calling "Nuggets"- useful bits of information about the process in general that should be extremely helpful either in getting started or avoiding pitfalls along the way. Check them out!
| Project Name | Areas of Interest | Primary Lab Tools Used | Researchers and (Mentors) | Date |
|---|---|---|---|---|
| Rapid fabrication of curved metasurfaces through wafer grinding | Wafer Grinding, PDMS processing, Creating PDMS molds | Robert Lupoiu, Chenkai Mao, Yixuan Shao, (Swaroop Kommera), (Lavendra Mandyam), (J Provine) | 06/2022 | |
| Nano Features Construction on PDMS Microfluidic Devices - Towards a Micro-Fuel Cell | Fuel Cells, Nanoscribe 3D Printing, PDMS Processing | Christian Barresi, Yuzhe Li, (Swaroop Kommera), (Tony Ricco) | 06/2022 | |
| Sub-micron metal patterning on polymer substrates using nitride nanostencil | Nano stencil, polymer and metal integration | Anqi Ji, Skyler Selvin, (Graham Ewing), (Swaroop Kommera), (Tony Ricco), (Mark Zdeblick) | 06/2021 | |
| Two-photon laser writing of micro-optics | Micro lenses | Ching-Ting Tsai, Yi-Shiou Du, (Swaroop Kommera), (Vijay Narasimhan), (J Provine) | 06/2021 | |
| Released Lithium Niobate Structures on Silicon using the PT-DSE | MEMS, structure release | Oliver Hitchcock, Takuma Makihara, (Usha Raghuram), (Tony Ricco), (Mark Zdeblick) | 06/2021 | |
| Cuprite (Cu2O) Rydberg Excitons for Integration with Photonics | photonics | Yakub Grzesik, Hope Lee, (Maurice Stevens), (Swaroop Kommera), (Don Gardner) | 06/2021 | |
| Graphene Growth on Ge(110) Substrates | graphene, germanium | Michelle Chen, Risa Hocking, (Swaroop Kommera), (Hye Ryoung Lee), (Michelle Rincon) | 06/2021 | |
| A photodefinable thermally-responsive hydrogel bilayer with SU-8 | hydrogels, SU-8 material properties | Paul Chong, Grace Woods, (Swaroop Kommera), (Tony Ricco), (Mark Zdeblick) | 06/2021 | |
| Plasma activated direct bonding of silicon and lithium niobate thin films | bonding of pieces, metasurfaces, wave guides | Sahil Dagli, Baba Ogunlade (Usha Raghuram), (Swaroop Kommera), (Vijay Narasimhan) | 06/2021 | |
| Fabrication of an Etched Silicon Microdissection Platform with Applications in Organotypic Culture and Personalized Immunotherapy Testing | Silicon patterning for tissue cutting | Nicolas Castaño, Seth Cordts, Saisneha Koppaka (Usha Raghuram), (Tony Ricco), (Mark Zdeblick) | 03/2020 | |
| 3D, pourous, electroplated metallic structures using two-photon lithography templates | 3D patterning and electroplating | Quianying Wu, Alisha Piazza, (Swaroop Kommera), (Tony Ricco) | 03/2020 | |
| Superconducting Parallel Plate Capacitors with High Kinetic Inductance | Superconductors, Capacitors | Kevin Multani, Debadri Das, Hubert Stokowski, (Usha Raghuram), (Swaroop Kommera), (Don Gardner) | 03/2020 | |
| Mechanical deformation of self-assembled inverse structures | 3D templates for nanostructures, sol-gel processing | David Doan, John Kulikowski, (Swaroop Kommera) | 03/2020 | |
| Low temperature ALD-Grown Superconducting Tunnel Contacts | Low temperature ALD | Molly Anderson, Ilan Rosen (Michelle Rincon), (J Provine), (Vijay Narasimhan) | 03/2020 | |
| SiNWs Thermoelectric Device Process Development | SiNW formation, MACE Etching | Rui Ning, Yue Jiang, Jihyun Baek, (Usha Raghuram), (Mark Zdeblick), (Don Gardner), (Daihong Huh) | 03/2020 | |
| ALD Process for Top-Gating 2D Materials | 2D Material integration, ALD, metal seed layers | Akash Levy, Jung-Soo Kim, (Michelle Rincon), (J Provine), (Vijay Narasimhan) | 03/2020 | |
| Bioprinting on 3D nanostructures with the Alveole PRIMO | Creating nanostructured templates for subsequent cell growth | Ching-Ting Tsai, Chih-Hao Lu, (Swaroop Kommera), (Zeinab Jahed), (Xiao Li), (Gaspard Pardon) | 03/2020 | |
| Etching Block Copolymer Directed Self-Assembly Holes | Directed Self Assembly, Nanoscale patterning | Maryanne Tung, Hansen Qiao, (Michelle Rincon), (Archana Kumar), (Jim Kruger) | 03/2019 | |
| P-GaN/AlGAN/GaN E-mode HEMT | MOCVD, HEMT | Seungbin Jeong, Anand Lalwani, (Xiaoqing Xu), (Caitlin Chapin), (Don Gardner), (Dong Lee) | 03/2019 | |
| Protein Photopatterning on PDMS in 3D with the Alveole PRIMO | Protein patterning | Chinmay Devmalya, Frank Charbonier, (Swaroop Kommera) | 03/2019 | |
| Roughness characterization of waveguides fabricated using the Heidelberg MLA150 Maskless Aligner | Optical waveguides, Maskless lithography | Payton Broaddeus, Aditi Datta, (Swaroop Kommera), (J Provine) | 03/2019 | |
| Non-destructive Micro to Nanoscale Metal Patterning for Probing Thermal Anisotropy | Stencil lithography | Chris Perez, Heungdong Kwon, (Usha Raguram), (J Provine) | 03/2019 | |
| Characterization of TMDs and Contact schemes for Photovoltaic Applications | TMD, photovoltaics | Arvindh Kumar, Koosha Nassiri Nazif, (Michelle Rincon) | 03/2019 | |
| Dry Etching of InSb Using OX-35 Etcher | Process development of InSb etch | Settasit Chaikasetsin, Matthew Gutwald, Kate Lee, (Usha Raghuram), (Jim McVittie) | 06/2018 | |
| Low-Cost and Robust Printing of Resistance Thermometer Sensors using the Voltera | Printing of commercial conductive inks | Ruiqi Chen, Alex Gruebele, Cheng Liu, (Swaroop Kommera) | 06/2018 | |
| MOCVD Regrown Ohmic Contacts to AlGaN/GaN Heterostructures | MOCVD regrowth, patterned in cleanroom and then return to MOCVD tools | Savannah Bennbrook, Yanni Dahmani, (Xiaoqing Xu) | 06/2018 | |
| Grayscale Lithography and Resist Reflow for Parylene Patterning | Grayscale lithography modeling, Parylene liftoff process development | Charmaine Chia, Joel Martis, (Swaroop Kommera) | 06/2018 | |
| Etch Rates of (Metal Oxide) ALD Films | ALD film etch rates in wet chemicals | Martin Winterkorn, Karen Kim, (Michelle Rincon), (J Provine) | 06/2018 | |
| Two-photon lithography for dielectric structures and electroplating molds for retinal prostheses | 3D structures on the nanoscale | Tiffany Huang, Charles Chen, Jack Andraka, David Heydari, (Swaroop Kommera) | 06/2018 | |
| Enabling Pattern Transfer for Block Copolymer Directed Self-Assembly | Nanoscale patterning, DSA | Maryanne Tung, (Michelle Rincon) | 06/2018 | |
| Wafer-Wafer Bonding Using Silicides for High-Temperature Applications | Silicide Bonding | Kirby Boone, Eric Wu, (Mahnaz Mansourpour), (Usha Raghuram), (J Provine) | 06/2018 | |
| Capacitive Deionization (CDI) Cell Fabrication with Voltera V-One Paste Dispenser | conductive ink making and patterning | Diego Huyke, Diego Oyarzun, (Swaroop Kommera) | 06/2018 | |
| 2D Materials Transfer in an Inert Atmosphere | Transfer station operations, 2D material damage evaluation | Victoria Chen, Connor Bailey, (Michelle Rincon) | 06/2018 | |
| InGaN-GaN Multiple Quantum Wells for Green LEDs on Si | Green LED | Ben Reeves, Ze Zhang, (Xiaoqing Xu) | 06/2018 | |
| Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications | Eutectic Bonding | Shougata Hazra, Yashvi Singh, (Usha Raghuram) | 06/2018 | |
| Grayscale lithography for chiral nanophotonic structures | Grayscale lithography process development | Jefferson Dixon, Michelle Solomon, (Swaroop Kommera) | 06/2018 | |
| Low Temperature Bonding for Neural Implant Fabrication | Bonding of 3D structures to chips | Pingyu Wang, Timothy Goh, (Usha Raghuram) | 06/2018 | |
| Standard Process for Prototyping Flexible Devices | Flexible device prototyping, photo-patternable polyimide, photo definable polyimide | Xiuian Chen, Nigel Clarke, Tae Myung Huh, (Hye Ryong Lee), (Swaroop Kommera) | 12/2017 | |
| Standard Operating Procedure of Optomec Aerosol Jet Printer in Pneumatic Atomizer Mode and Characterization of Printed PEDOT:PSS Lines | Ink jet printing of nano-particles, PEDOT | Kye Young Lee, Camila Cendra, Theo Gao, (Swaroop Kommera), (Hye Ryong Lee) | 12/2017 | |
| Epitaxy of GaAs on transferred CVD graphene | GaAs, graphene | John Roberts, Tim Chen, (Xiaoqing Xu) | 12/2017 | |
| XFab Micromachining: Uses & Limitations | Micromaching applications | Abdul Obaid, Minna Hanna, (Michelle Rincon), (Elmer Enriquez) | 12/2017 | |
| Physical and Electrical Characterization of RF-Sputtered ITO Films for Use as Solar Cell Electrodes as well as Interlayers in Low-Resistance MIS Contacts in Ge/Si Transistors | Sputtering ITO for solar cell electrodes | Koosha Nazif, Haydee Pacheco, (Maurice Stevens) | 12/2017 | |
| MOCVD of InAlN/GaN on Si Heterostructures for High-Temperature High-Electron-Mobility Transistors (HEMT) | HEMTS, InAlN/GaN on Si | Thomas Heuser, Ricardo Peterson, (Xiaoqing Xu) | 12/2017 | |
| Direct Patterning of Proteins with the Alveole PRIMO | Protein patterning | Erica Castillo, Joy Franco (Swaroop Kommera) | 12/2017 | |
| Preparation of ultra-smooth platinum films | Ultra-smooth metal films | Charmaine Chia, (Michelle Rincon) | 12/2017 | |
| Controlled metal Deposition on Flexible Polyethylene Substrates by Sputtering for CO2 Reduction | Sputtering on flexible materials | Jun Li, (Xioaqing Xu), (HyeRyoung Lee) | 12/2016 | |
| Development and characterization of wax molds for 3D microfluidic applications | Microfluidics, 3D Printing | Rex Garland, Jonah Kohen, Fengjiao Lyu, (Michelle Rincon) | 12/2016 | |
| Optimizing the Electrical Stability of Platinum Films Deposited in Lesker - Sputter | Sputtering | Kirsten Kaplan, Karen Kim, Martin Winterkorn, (J Provine), (Siva Baskharan) | 12/2016 | |
| Development of thermocompression and eutectic bond processes for pre-patterned substrates using the Finetech Lambda | Flip Chip Bonding | KiWook Jung, Heungdong Kwon, (Usha Raghuram) | 12/2016 | |
| Ink preparation and inkjet printing of eutectic gallium indium nanodroplets | Nanoparticle inkjet printing | Eric Wu, (HyeRyoung Lee), (Xiaoqing Xu) | 12/2016 | |
| Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils | Flip Chip Bonding | Karen Dowling, Mimi Yang, (J Provine), (Usha Raghuram), (Astrid Tomada) | 12/2016 | |
| Sapphire flip-Âchip thermocompression and eutectic bonding for dielectric laser accelerator | Flip Chip Bonding | Huiyang Deng, Yu Miao, (Usha Raghuram) | 12/2016 | |
| NMOS-Depletion Mode Process for EE410 | EE410 redesign- NMOS depletion mode process flow for quick, robust devices | Max Shulaker, Rebecca Park, (Usha Raghuram) | 12/2015 | |
| Low-T, High-K, Dielectrics for Transparent and Flexible 2-Dimensional Electronics | Creating Low-T, High-K devices including ALD directly onto flexible, transparent substrate and subsequent processing | Kirby Smithe, (Michelle Rincon) | 12/2015 | |
| 3D Printing Using theSolidscape Studio for Rapid Prototyping of Optics and Microfluidic Devices | Using new 3D printer to create molds for PDMS processing for microfluidics and optical devices. | Stephen Hanman, Saara Khan, (Robert Chen) | 12/2015 | |
| Three-dimensional Current Collector for Advanced Microbatteries | Using multiple coat lithography process to pattern electrodes for electroplating | Dingchang Lin, Yayuan Liu, Jia Zhao, (Robert Chen) , (Michelle Rincon) | 12/2015 | |
| Aligned SWCNT Growth in SNF using FirsNano CNT Furnace | Aligned, horizontal, SWCNT growth on quartz using ethanol with a quartz substrate | Greg Pitner, (Michelle Rincon), (Robert Chen) | 12/2015 | |
| Optimization of Silicon Isotropic Plasma Etch in PT-DSE for GOPHER Process | Optimizing Isotropic etching in the PT-DSE | Andrew Ceballos, (Usha Raghuram) | 12/2015 | |
| GaAs Rapid Melt Growth (RMG) process | Developing a GaAs Rapid Melt Growth (RMG) process to produce crystalline GaAs on silicon | Xue Bai, (Xiaoxing Xu) | 12/2015 | |
| Atomic Layer Deposition of Aluminum Doped Zinc Oxide | Creating Al doped ZnO on the Savannah ALD | Jiheng Zhao, Sidi Huang, Sangwook Park, (Michelle Rincon) | 12/2015 | |
| Functionalization & Optical Characterization of Colloidal Gold Nanoparticles on Planar Substrates | Using the Cytoviva Hyperspectral Imaging microscope to evaluate gold nanoparticle dispersion on planar substrates | Charmaine Chia, (Michelle Rincon), (Robert Chen) | 12/2015 | |
| Black Magic Pro 4" Graphene Furnace Development and Characterization | Graphene process development on copper substrates | Ning Wang, Christopher Neuman, (Michelle Rincon), (Robert Chen), (Ted Berg) | 06/2015 | |
| Low Vapor Pressure Precursor Delivery: A Case Study in MLD of Polyimide | Process development for polyimide MLD, Savannah thermal management understanding | Tim English, (J Provine), (Michelle Rincon) | 06/2015 | |
| Deep Oxide Etch in PT-Ox to Replace Dicing and Polishing Process | Etch process to replace dicing and polishing for photonic waveguide testing | Alex Piggott, (Usha Raghuram) | 06/2015 | |
| Development of Thin Film Release of GaN using AlN and AlGaN Buffer Layers for MEMS Applications | MEMS, MOCVD, GaN, AlN, AlGaN, development of wet etch chemistry for AlGaN | Caitlin Chapin, Karen Dowling, (Xiaoxing Xu) | 06/2015 | |
| Variable Trench Optimization for DRIE of SOI in PT-DSE | DRIE, SOI, PT-DSE | Ian Flader, Yunhan Chen, (Usha Raghuram) | 06/2015 | |
| Vapor Phase Doping of Boron in Silicon | Alternative to implantation for boron doping of silicon using Epi | Kai Zang, (Maurice Stevens), (Ted Kamins) | 06/2015 | |
| FirstNano CNT Growth Furnace Recipe Development in SNF | Process development for aligned, horizontal nanotube growth with methane on quartz substrate in the new CNT furnace | Greg Pitner, Ryan Swoboda, (Michelle Rincon), (Robert Chen) | 06/2015 | |
| MOCVD Growth Calibration for GaN LED on Silicon | III-V, MOCVD InGaN, GaN and AlGaN on silicon doping | Yusi Chen, Jieyang Jia, (Xiaoxing Xu) | 06/2015 | |
| Vertical Semiconductor Blades | MOCVD, ASML, double exposure, JEOL, InSb, Ox III-V | Martin Winterkorn, Anup Dadlani, Karen Kim, (J Provine) | 06/2015 | |
| Ge/SiGe Surface Passivation by ALD | Ge/SiGe photo luminescence modification by ozone induced oxidation, annealing, and capping in ALD system | Ching-Ying Lu, Muyu Xue, (Michelle Rincon), (J Provine) | 06/2015 | |
| Atomic Layer Deposition of Zinc Oxide | ALD ZnO deposition | Pranav Ramesh, Jiheng Zhao, (J Provine), (Michelle Rincon) | 12/2014 | |
| PECVD SiNx Conformal Stressor Films | SiNx stress and conformity, added strain from backside and sidewall deposition | Ching-Ying Lu, Matthew Morea, (Usha Raghuram), (Jim McVittie), (Prof Jim Harris) | 12/2014 | |
| Development of Fluorine Plasma for AlGa/GaN Device Isolation | Heterostructure based device isolation | Caitlin Chapin, Minmin Hou, (Usha Raghuram), (Prof Senesky) | 12/2014 | |
| Smooth Sidewall Etching in PT-DSE | High aspect ratio etches with smooth sidewalls, 'Bosch' process recipes | Andrew Ceballos, Stephen Hamann, (Usha Raghuram) | 12/2014 | |
| ALD Precursor Delivery & Debugging: A Case Study in Polymer Development | PMDA, ODA | Felix Alfonso, Tim English, (Michelle Rincon), (J Provine) | 12/2014 | |
| Surface Micromachining Method for Releasing a Range of Micron-Scale Membranes | MEMS, release strategies | Martin Winterkorn, Anup Dadlani, Yongmin Kim, (J Provine), (Michelle Rincon) | 12/2014 | |
| Molecular Vapor Deposition and Patterning of Organosilane Self-Assembled Monolayers for Directed Growth of Neuron Cells | Hydrophilic (ODS) and Hydrophobic (DETA) SAMS deposition on Pyrex and Si, uniformity and film quality | Felix Alfonso, Hsin-Ya Lou, (Michelle Rincon), (J Provine) | 06/2014 | |
| SiNx PECVD and Nanostructure Etching Recipe Development | PECVD SiNx stress, Nanosphere etching | Yusi Chen and Muyu Xue | 06/2014 | |
| Procedure to Deposit Gold Only on the Sidewalls of Rectangular Nanostructures and Its Application | Sidewall metal deposition on nanostructures | Zain Zaidi | 06/2014 | |
| TiN Characterization | Faster, better ALD TiN films | Kye Okabe, Max Shulaker, (Michelle Rincon), (J Provine) | 06/2014 | |
| Bulk Silicon Carbide etching in PT-MTL | SiC etching in PT-MTL | Karen Dowling and Ashwin Shankar | 06/2014 | |
| Developing a Standard Recipe for Thermal ALD Tantalum Pentoxide film | Ta2O5 ALD thermal recipe development | Ki Wook Jung, (Michelle Rincon), (J Provine) | 06/2014 | |
| ALD Dielectric Electrical Characterization | High-k dielectrics, Al2O3, HfO, MOSCAP | Max Shulaker, (Michelle Rincon), (J Provine) | 06/2014 | |
| Developing Etching Process for Nanostructures on InGaP and AlInP Using OX-35 Etcher | InGaP and AlInP etching | Jieyang Jia, Li Zhao, (Mary Tang), (Jim McVittie) | 06/2014 | |
| Characterization of Fiji ALD Film Quality and Conformality in High Aspect Ratio/Deep Etched Structures | Conformality of ALD films; Al2O3, TiN and Pt | Insun Park, Jooyong Sim, Young Ik Sohn, (J Provine) | 12/2011 | |
| Develop Calibration Process for Innotec Tilt Angle Jig | Calibration of Tilt Angle Jig for Innotec | Shane Crippen, (J Provine) | 12/2011 | |
| Mix and Match: E-beam and Optical Lithography for Optical Gratings and Waveguide | Mixing Optical and E-beam Lithography | Chia-Ming Chang | 06/2011 | |
| Characterization of metal-nitride films deposited by the Savannah ALD system | ALD metal-nitride films | Adair Gerke, Suhas Kumar, (J Provine), (Krishna Saraswat) | 06/2011 | |
| Corrosive Resistant ALD Coatings | Corrosive resistant ALD films; Al2O3, HfO2 and ZrO2 | Joseph Doll, Alexandre Haemmerli, (J Provine) | 06/2011 | |
| Sputtering Deposition of Metal and Dielectric Films | Low temp deposition of Ti, SiO2 and W | Vijay Parameshwaran, (Ed Myers) | 06/2011 | |
| AGILE: Axially Graded Index Lens Fabrication | Graded Index lens using polymer layers of Norland Optical Adhesive with varying Refractive Indices | Nina Vaidya, (Tom Carver) | 06/2011 | |
| Characterization of EV Spraycoater; Conformal Coating in deep Trenches | Spray coating of resist in 30-50um deep Si trenchs | Ehsan Sadeghipour, (Mahnaz Mansourpour), (Jason Parker) | 03/2011 | |
| High-k/SiO2 interface Charge Characterization for ALD tools | Charge density study for HfO2 and Al2o3 | Hong-Yu Chen, Luckshitha, (J Provine) | 03/2011 | |
| A Low Temperature, Low Stress SiGe Process | Low Temp, Low Stress SiGe Process | Scott Lee and Chen Chen | 03/2011 | |
| High Aspect Ratio Si Etching in STS2 | HAR Etch for STS2 | Jae-Woong Jeong, (Jim McVitte) | 12/2010 | |
| STSetch2 Profile Characterization- Undercut Investigation for Silicon Trench Etching in STSetch2 | STSetch2 Profile Characterization | Lele Wang, Dong Liang, Yu-Shuen Wang, (Jim McVittie) | 12/2010 | |
| Development of Four Nitride Films; TiN, Hf3N4, WN, and AlNDevelopment of Four Nitride Films; TiN, Hf3N4, WN, and AlN | ALD nitride films | Shingo Yoneoka, Yi-Hsuan, Scott Lee, Chu-En Chang, (J Provine) | 12/2010 | |
| Deep Trench Spray Coating | Spray coating of resist in 350um deep Si trench | Karthik Vijayraghavan | 12/2010 | |
| ALD Nanolaminates | ALD HfO2 and Al2O3 films | Yi Wu, Shimeng Yu, Shuang Li, (J Provine) | 12/2010 |
Last modified: 28 Apr 2022
