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Wafer-Wafer Bonding Using Silicides for High-Temperature Applications

Project Type: 
June 2018
Areas of Interest: 
Silicide Bonding
Processing Technique (former Function and Method): 
Researchers and (Mentors): 
Kirby Boone, Eric Wu, (Mahnaz Mansourpour), (Usha Raghuram), (J Provine)
List of Important Equipment: 
Nano Nugget(s): 

Helpful hints about getting started on a wafer bonding project including tools to get trained on, material selection, and device design.