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Wafer-Wafer Bonding Using Silicides for High-Temperature Applications

Project Type: 
E241
Date: 
June 2018
Areas of Interest: 
Silicide Bonding
Report(s): 
Wafer-Wafer Bonding using Metal Silicides for High Temperature Applications- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Kirby Boone, Eric Wu, (Mahnaz Mansourpour), (Usha Raghuram), (J Provine)
Nano Nugget(s): 

Nickel Silicide Bonding Tips

Helpful hints about getting started on a wafer bonding project including tools to get trained on, material selection, and device design.

Presentation(s): 
Wafer-wafer bonding using silicides for high-temperature applications- Final Presentation