Project Type: 
E241
Date: 
June 2018 (all day)
Areas of Interest: 
Silicide Bonding
Report: 
Wafer-Wafer Bonding using Metal Silicides for High Temperature Applications- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Kirby Boone, Eric Wu, (Mahnaz Mansourpour), (Usha Raghuram), (J Provine)
Nano Nugget: 
Presentation: 
Wafer-wafer bonding using silicides for high-temperature applications- Final Presentation