Wafer-Wafer Bonding Using Silicides for High-Temperature Applications
Processing Technique (former Function and Method):
Researchers and (Mentors):
Kirby Boone, Eric Wu, (Mahnaz Mansourpour), (Usha Raghuram), (J Provine)
List of Important Equipment:
Nano Nugget(s):
Helpful hints about getting started on a wafer bonding project including tools to get trained on, material selection, and device design.