Project Type: 
E241
Date: 
June 2018 (all day)
Areas of Interest: 
Eutectic Bonding
Report: 
Au-Sn Eutectic Chip-Bonding for High Heat-Flux Vapor-Chamber Applications- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Shougata Hazra, Yashvi Singh, (Usha Raghuram)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Nano Nugget: 
Presentation: 
Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications- Final Presentation