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Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications

Project Type: 
E241
Date: 
June 2018
Areas of Interest: 
Eutectic Bonding
Report(s): 
Au-Sn Eutectic Chip-Bonding for High Heat-Flux Vapor-Chamber Applications- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Shougata Hazra, Yashvi Singh, (Usha Raghuram)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Nano Nugget(s): 

Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications using Flip Chip Bonder: Suggestions and Tips

Here are some getting started tips for use of Pyrex wafers in the SNF lithography and Flip Chip Bonding equipment.

Presentation(s): 
Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications- Final Presentation