Project Type: 
E241
Date: 
December 2016 (all day)
Areas of Interest: 
Flip Chip Bonding
Report: 
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Karen Dowling, Mimi Yang, (J Provine), (Usha Raghuram), (Astrid Tomada)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Presentation: 
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Presentation