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Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils

Project Type: 
December 2016
Areas of Interest: 
Flip Chip Bonding
Processing Technique (former Function and Method): 
Researchers and (Mentors): 
Karen Dowling, Mimi Yang, (J Provine), (Usha Raghuram), (Astrid Tomada)
List of Important Equipment: