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Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils

Project Type: 
E241
Date: 
December 2016
Areas of Interest: 
Flip Chip Bonding
Report(s): 
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Karen Dowling, Mimi Yang, (J Provine), (Usha Raghuram), (Astrid Tomada)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Presentation(s): 
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Presentation