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Low Temperature Bonding for Neural Implant Fabrication

Project Type: 
June 2018
Areas of Interest: 
Bonding of 3D structures to chips
Processing Technique (former Function and Method): 
Researchers and (Mentors): 
Pingyu Wang, Timothy Goh, (Usha Raghuram)
List of Important Equipment: 
Nano Nugget(s): 

“Tips” or “tricks” on use of the Lambda Flipchip Bonder and the integration with lithography and metallization steps that are used in preparation for bonding.