Project Type: 
E241
Date: 
June 2018 (all day)
Areas of Interest: 
Bonding of 3D structures to chips
Report: 
Low Temperature Bonding for Neural Implant Fabrication- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Pingyu Wang, Timothy Goh, (Usha Raghuram)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Nano Nugget: 
Presentation: 
Low temperature bonding for neural implant fabrication- Final Presentation