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Low Temperature Bonding for Neural Implant Fabrication

Project Type: 
E241
Date: 
June 2018
Areas of Interest: 
Bonding of 3D structures to chips
Report(s): 
Low Temperature Bonding for Neural Implant Fabrication- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Pingyu Wang, Timothy Goh, (Usha Raghuram)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Nano Nugget(s): 

Finetech Lambda Flipchip Bonder and Process Integration New User Tips

“Tips” or “tricks” on use of the Lambda Flipchip Bonder and the integration with lithography and metallization steps that are used in preparation for bonding.

Presentation(s): 
Low temperature bonding for neural implant fabrication- Final Presentation