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PECVD SiNx Conformal Stressor Films

Project Type: 
E241
Date: 
December 2014
Areas of Interest: 
SiNx stress and conformity, added strain from backside and sidewall deposition
Report(s): 
PECVD SiNx Conformal Stressor Films- Final Report
Processing Technique (former Function and Method): 
Plasma Enhanced (PE) CVD
Researchers and (Mentors): 
Ching-Ying Lu, Matthew Morea, (Usha Raghuram), (Jim McVittie), (Prof Jim Harris)
Presentation(s): 
PECVD SiNx Conformal Stressor Films- Final Presentation