Development of thermocompression and eutectic bond processes for pre-patterned substrates using the Finetech Lambda

Project Type:

E241

Date:

December 2016 (all day)

Areas of Interest:

Flip Chip Bonding

Report:

Processing Technique (former Function and Method):

Bonding

Researchers and (Mentors):

KiWook Jung, Heungdong Kwon, (Usha Raghuram)

List of Important Equipment: