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Development of thermocompression and eutectic bond processes for pre-patterned substrates using the Finetech Lambda

Project Type: 
E241
Date: 
December 2016
Areas of Interest: 
Flip Chip Bonding
Report(s): 
Development of thermocompression and eutectic bond processes for pre-patterned substrates using the Finetech Lambda- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
KiWook Jung, Heungdong Kwon, (Usha Raghuram)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)