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Germanium

Chemical Formula: 
Ge
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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort descending Notes
Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly
Tystar LPCVD Tube Training Flexible SNF Cleanroom Paul G Allen L107
Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO
Tystar LPCVD Tube Training Flexible SNF Cleanroom Paul G Allen L107
Critical Point Dryer Tousimis Automegasamdri-936
cpd
Critical Point Dryer Training Flexible SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

CHA Solutions II Evaporator
cha-evap
Evaporator CHA Training Flexible SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance

Fiji 2 ALD
fiji2
ALD Fiji 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107
Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All SNF Cleanroom Paul G Allen L107

3 Probe Heads for different cleanliness groups.

Savannah ALD
savannah
ALD Savannah Training Flexible SNF Cleanroom Paul G Allen L107
SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Woollam
woollam
Woollam Training All SNF Cleanroom Paul G Allen L107
SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

Headway Manual Resist Spinner
headway2
Resist Coat (manual) Headway Manual Training All SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Resist Developer Process Temperature Range Gases Sample Size Limits Substrate Size Substrate Type Maximum Load
Nanospec 210XP
nanospec2
All ,
,
,
,
,
,
,
,
Oven (White)
white-oven
Flexible
0 °C - 200 °C
,
,
,
,
,
,
,
,
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Oven 90°C prebake
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100.00 Å - 4.00 μm
100 °C - 350 °C
,
,
,
,
,
,
,
,
4
Profilometer Alphastep 500
alphastep
Flexible ,
,
,
,
,
,
,
,
1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
1
Prometrix Resistivity Mapping System
prometrix
All ,
,
,
,
,
,
,
,
1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah ALD
savannah
Flexible
1.00 Å - 50.00 nm
24 °C - 250 °C
,
,
,
,
,
,
,
,
,
,
,
,
SEM -Zeiss Merlin
sem-merlin
All
0.00 mm - 35.00 mm
6 in wafer ,
,
,
,
,
,
,
,
,
,
one
Sensofar S-neox
s-neox
All ,
,
,
,
,
,
,
,
1
SPTS uetch vapor etch
uetch
All ,
,
,
,
,
,
,
,
,
1
SVG Develop Track 1
svgdev
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Develop Track 2
svgdev2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 1
svgcoat
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 2
svgcoat2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
Tencor P2 Profilometer
p2
Clean, Semiclean ,
,
,
,
,
,
,
,
1
Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly
Flexible
25.00 Å - 2.00 μm
420 °C - 630 °C
,
,
,
,
,
100

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