Skip to content Skip to navigation

Ammonia

Chemical Formula:

NH₃

Gases Equipment Tabs

Etch Equipment Table

No equipment matches all of the filter criteria you have set above.

Anneal/Oxidation Equipment Table

Deposition Equipment
Equipment name & Badger ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
Aixtron MOCVD - III-N system aix-ccs	Clean (MOCVD)	SNF MOCVD Paul G Allen 213XA	0.00 - 5.00 μm	AlGaN AlN GaN III-N materials InAlN InGaAlN InGaN InN
Fiji 1 ALD fiji1	Semiclean	SNF Cleanroom Paul G Allen L107	1.00 Å - 50.00 nm	Metal oxides Al₂O₃ HfN HfO₂ Pt Ru SiO₂ Ta₂O₅ TaN TiN TiO₂ Various Dielectrics ZrO₂
Fiji 3 ALD fiji3	Flexible	SNF Cleanroom Paul G Allen L107	1.00 Å - 50.00 nm	Al₂O₃ HfO₂ SiO₂ TiO₂ Various Dielectrics
PlasmaTherm Shuttlelock PECVD System ccp-dep	All	SNF Cleanroom Paul G Allen L107	100.00 Å - 4.00 μm	Si Si3N4 SiC SiO₂ SiON
RTA AllWin 610 aw610_l	Clean	SNF Cleanroom Paul G Allen L107
RTA AllWin 610 aw610_r	Flexible	SNF Cleanroom Paul G Allen L107
Tystar Bank 2 Tube 7 Nitride B2T7 Clean Nitride	Clean	SNF Cleanroom Paul G Allen L107	25.00 Å - 2.00 μm	Si3N4 SiON
Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride	Clean	SNF Cleanroom Paul G Allen L107	25.00 Å - 2.00 μm	Si3N4 SiON