This is a summary of the metallization equipment, grouped by deposition types: Evaporation and Sputtering.
Equipment | Cleanliness | Materials Lab Supplied | Materials User Supplied | Material Thickness Range | Substrate Size | Maximum Load | Notes | Location |
---|---|---|---|---|---|---|---|---|
Intlvac Evaporator (Intlvac_evap) | Clean, Semiclean |
0.00 -
0.50 μm
|
12 4 inch wafers, 2 6 inch wafers | SNF Cleanroom Paul G Allen L107 | ||||
AJA2 Evaporator (aja2-evap) | Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces |
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in... |
SNF Cleanroom Paul G Allen L107 | |||
CHA Solutions II Evaporator (cha-evap) | Flexible |
0.00 -
300.00 nm
|
4"x15 or 6"x3 wafers or pieces |
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in... |
SNF Cleanroom Paul G Allen L107 | |||
AJA Evaporator (aja-evap) | Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in... |
SNF Exfab Paul G Allen 155A Venice |
Equipment | Cleanliness | Materials Lab Supplied | Materials User Supplied | Material Thickness Range | Substrate Size | Maximum Load | Notes | Location |
---|---|---|---|---|---|---|---|---|
Lesker2 Sputter (lesker2-sputter) | Semiclean |
1.00 μm
|
one 4 inch wafer, one 6 inch wafer |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
SNF Cleanroom Paul G Allen L107 | |||
Lesker Sputter (lesker-sputter) | Flexible |
|
1 4 inch wafer, 1 6 inch wafer |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
SNF Exfab Paul G Allen 155A Venice |
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