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Oxidation and Annealing Equipment Summary

Oxidation and Annealing Equipment Summary

Rapid Thermal Annealing
Equipment Name Cleanliness Material Thickness Range Cleaning Required Substrate Size Maximum Load Process Temperature Range Gases
RTA AllWin 610 (aw610_r) Flexible
21 °C - 1150 °C
RTA AllWin 610 (aw610_l) Clean
Pre-Diffusion Clean 1 wafer
21 °C - 1150 °C
Last modified: 30 Apr 2020