Direct Write
Pieces need a carrier wafer; Isotropic Etching
Bakes wafers with resist after the development, called post-bake.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Wet Resist Removal: SRS-100 or PRS1000
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
