Compound materials with chemical elements from the III and V groups of the periodic table.
Automatic Resist spinning and bake
Automatic development.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or resist removal.
Manual solvent cleaning, two ultrasonic baths.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Isotropic Si etching; can be used for backside Si removal on small pieces
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
non contact 3D optical profiling
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Direct Write