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Quartz

Chemical Formula: 
SiO2
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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort descending Notes
Keyence Digital Microscope VHX-6000
keyence
Microscope Keyence Training All SNF Exfab Paul G Allen 104 Stinson
Finetech Lambda
flipchipbonder
Flip Chip Bonder Training Flexible SNF Exfab Paul G Allen 104 Stinson
Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

Nanospec 210XP
nanospec2
Nanospec Training All SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

SEM -Zeiss Merlin
sem-merlin
SEM-Merlin Training All SNF Exfab Paul G Allen 104 Stinson
Profilometer Alphastep 500
alphastep
Alphastep 500 Profilometer Training Flexible SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

Profilometer AlphaStep D-300
alphastep2
AlphaStep2 Training Flexible SNF Exfab Paul G Allen 104 Stinson
Savannah ALD
savannah
ALD Savannah Training Flexible SNF Cleanroom Paul G Allen L107
Wet Bench Solvent Lithography
lithosolv
Lithography Solvent Bench Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Oven 110°C post-bake
oven110
Resist Postbake Oven 110°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

Tystar Bank 2 Tube 6
B2T6 Clean Oxide
Tystar Atmospheric Tube Training Clean SNF Cleanroom Paul G Allen L107
Woollam
woollam
Woollam Training All SNF Cleanroom Paul G Allen L107
Wet Bench Clean_res-piranha
wbclean_res-piranha
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Cleanroom Paul G Allen L107

Resist will be removed

Oven 90°C prebake
oven90
Resist Prebake Oven 90°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

Intlvac Evaporator
Intlvac_evap
Evaporator Intlvac Training Clean, Semiclean SNF Cleanroom Paul G Allen L107
Tystar Bank 3 Tube 9
B3T9 Clean Oxide
Tystar Atmospheric Tube Training Clean SNF Cleanroom Paul G Allen L107
Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Karl Suss MA-6 Contact Aligner
karlsuss2
Contact Aligner Karl Suss MA-6 Training All SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align.

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

Tystar Bank 1 Tube 1
B1T1 Flexible Oxide
Tystar Atmospheric Tube Training Flexible SNF Cleanroom Paul G Allen L107

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Equipment name & NEMO ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Aixtron MOCVD - III-V system
aix200
Pre-Diffusion Clean Flexible
0.00 - 5.00 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
AJA Evaporator
aja-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
Critical Point Dryer Tousimis Automegasamdri-915B
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible ,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
EVG 101 Spray Coater
evgspraycoat
All ,
,
,
,
1
EVG Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch ,
,
,
,
one piece or wafer
EVG Wafer Bonder
evbond
Flexible ,
,
,
,
,
Fiji 1 ALD
fiji1
Semiclean
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Fiji 2 ALD
fiji2
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Finetech Lambda
flipchipbonder
Flexible
°C - 400 °C
,
,
,
,
,
1
First Nano carbon nanotube CVD furnace
cvd-nanotube
Flexible
800 °C - 1100 °C
,
1x4" wafer or multiple pieces
Flexus 2320 Stress Tester
stresstest
All ,
,
,
,
,
,
,
,
1
Headway Manual Resist Spinner
headway2
All ,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
Intlvac Evaporator
Intlvac_evap
Clean, Semiclean
0.00 - 0.50 μm
,
,
12 4 inch wafers, 2 6 inch wafers
Karl Suss MA-6 Contact Aligner
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,

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