EVG Contact Aligner (evalign)
Overview
The EVG Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our current configuration accommodates 100 or 150mm wafers for exposure with bonding substrates limited to 100mm (EV Bonder).
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Lithography Specifications
Substrate Type
Substrate Sizes
Maximum Load:
one piece or wafer
Notes:
1:1 Contact Aligner.
Anodic Bond, backside align, including IR.
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
SNF: Photolithography
NEMO ID:
evalign
Training and Maintenance
Lab Facility:
Training Charges:
1.50 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- "All Litho" class is required before training on any of the lithography tools. Please send an email to all-litho-training@lists.stanford.edu to sign up for the All Litho class. Read more here: All Litho class.
- Study the relevant operating procedures:
- Contact the primary trainer: Cliff Knollenberg
