Skip to content Skip to navigation

EVG Contact Aligner (evalign)


The EVG Contact Aligner system is part of the Electronic Visions 620 aligner- 501 bonder system. This tool can perform mask-to-wafer alignment for exposure or wafer-to-wafer alignment for bonding. Our current configuration accommodates 100 or 150mm wafers for exposure with bonding substrates limited to 100mm (EV Bonder).


Processing Technique(s)

Capabilities and Specifications

Lithography Specifications

Minimum Resolution: 
1.50 μm
Exposure Wavelength: 
350 - 450 nm
Mask Size: 
Max Exposure Area: 
5 inch mask = 4 inch, 7 inch mask = 6 inch
Maximum Load: 
one piece or wafer

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

Lab Organization, Location, and NEMO Information

NEMO Area: 
SNF: Photolithography

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. "All Litho" class is required before training on any of the lithography tools. Please send an email to to sign up for the All Litho class. Read more here: All Litho class.
  2. Study the relevant operating procedures:
  3. Contact the primary trainer: Cliff Knollenberg

Operating Instructions