Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Automatic Resist spinning and bake
Automatic development.
Pieces need a carrier wafer; Isotropic Etching
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Convection in N2. Cure. Programmable.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Bakes wafers with resist after the development, called post-bake.
