Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or resist removal.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Isotropic Si etching; can be used for backside Si removal on small pieces
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
non contact 3D optical profiling
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Direct Write
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
