Short Name:
4"
The following is a list of equipment where 4 inch round substrates are allowed.
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Resist | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 | |||||||||||||||||||
|
Headway 3 Manual Resist Spinner headway3 |
"All" | 1 piece or wafer | |||||||||||||||||||
|
Headway Manual Resist Spinner headway2 |
"All" | one piece or wafer | |||||||||||||||||||
|
Heidelberg MLA 150 heidelberg |
"All" |
|
405 nm | 1 | |||||||||||||||||
|
Heidelberg MLA 150 - 2 heidelberg2 |
"All" |
|
375 nm | 1 | |||||||||||||||||
|
Heidelberg3 heidelberg3 |
"All" | 1 | |||||||||||||||||||
|
HMDS Vapor Prime Oven, YES yes |
"All" |
150 ºC
|
|||||||||||||||||||
|
Intlvac Evaporator Intlvac_evap |
Flexible |
0.00 -
0.50 μm
|
12 4 inch wafers, 2 6 inch wafers | ||||||||||||||||||
|
Karl Suss MA-6 Contact Aligner karlsuss |
"All" |
|
365 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch | ||||||||||||||||
|
Karl Suss MA-6 Contact Aligner karlsuss2 |
"All" |
|
365 nm or 405 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch | ||||||||||||||||
|
Keyence Digital Microscope VHX-6000 keyence |
"All" | ||||||||||||||||||||
|
KLA-Rapier Deep Reactive Ion Etcher KLA-DSE |
Pre-Diffusion Clean | Clean |
-10 °C - 40 °C
|
No through etch on full wafers. Stop 100microns before the through etch and use carrier wafer | |||||||||||||||||
|
Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean | 25 | |||||||||||||||||||
|
Laurell Manual Resist Spinner laurell-R |
"All" | ||||||||||||||||||||
|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
"All" | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
1 wafer(2" to 8") | |||||||||||||||||
|
Lesker Sputter lesker-sputter |
Flexible | 1 4 inch wafer, 1 6 inch wafer | |||||||||||||||||||
|
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
one 4 inch wafer, one 6 inch wafer | |||||||||||||||||
|
Matrix Plasma Resist Strip matrix |
Flexible | 25 | |||||||||||||||||||
|
Micromanipulator6000 IV-CV probe station micromanipulator6000 |
"All" | 1x4" wafer | |||||||||||||||||||
|
MRC Reactive Ion Etcher mrc |
Flexible |
|
1 |