Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Wet Resist Removal: SRS-100 or PRS1000
Convection in N2. Cure. Programmable.
Manual solvent cleaning, two ultrasonic baths.
Bakes wafers with resist after the development, called post-bake.
Manual solvent cleaning, hot plate
Bakes wafers after resist coating.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
1:1 Contact Aligner. Backside align.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
1:1 Contact Aligner. Backside align, including IR.