1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
non contact 3D optical profiling
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Manual solvent cleaning of substrates or resist removal.
3 Probe Heads for different cleanliness groups.
CO2 drying after release of micromachined devices
Isotropic Si etching; can be used for backside Si removal on small pieces
Automatic development.
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Automatic Resist spinning and bake
Pieces need a carrier wafer; Isotropic Etching
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
