For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Bakes wafers after resist coating.
Wet Resist Removal: SRS-100 or PRS1000
1:1 Contact Aligner. Backside align.
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
non contact 3D optical profiling