3 Probe Heads for different cleanliness groups.
Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
non contact 3D optical profiling
Manual solvent cleaning of substrates or resist removal.
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
CO2 drying after release of micromachined devices
Isotropic Si etching; can be used for backside Si removal on small pieces
