500Å to 300µm
Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Manual solvent cleaning, hot plate
non contact 3D optical profiling
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Manual solvent cleaning of substrates or resist removal.
3 Probe Heads for different cleanliness groups.
CO2 drying after release of micromachined devices
Isotropic Si etching; can be used for backside Si removal on small pieces
Automatic development.
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Automatic Resist spinning and bake
Pieces need a carrier wafer; Isotropic Etching
