Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Manual solvent cleaning of substrates or resist removal.
1:1 Contact Aligner. Backside align, including IR.
Direct Write
CO2 drying after release of micromachined devices
5:1 reducing stepper
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
No resist allowed. Resist should have been removed at the wbclean_res-piranha.
Resist should have been removed
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Isotropic Si etching; can be used for backside Si removal on small pieces
