reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Direct Write
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
non contact 3D optical profiling
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Isotropic Si etching; can be used for backside Si removal on small pieces
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
