The following is a list of equipment where 2 inch round substrates are allowed.
3 Probe Heads for different cleanliness groups.
Manual development of resist in beakers. SNF approved developers only. No solvents!
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Direct Write
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Convection in N2. Cure. Programmable.
3 probe heads for different cleanliness groups.
Wet Resist Removal: SRS-100 or PRS1000
Bakes wafers with resist after the development, called post-bake.
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Bakes wafers after resist coating.
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align.