Silicon Carbide

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Direct Write

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Bakes wafers with resist after the development, called post-bake.

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run