Compound materials with chemical elements from the III and V groups of the periodic table.
Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Resist | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
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Aixtron MOCVD - III-V system aix200 |
Pre-Diffusion Clean | Flexible |
0.00 -
5.00 μm
|
300 °C - 800 °C
|
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4"x1 wafer or 2"x1 wafer or 4 pieces | |||||||||||||
AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
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4"x3 or 6"x1 wafers or pieces | |||||||||||||||
Critical Point Dryer Tousimis Automegasamdri-936 cpd |
Flexible |
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DISCO Wafer Saw DISCO wafersaw |
Flexible |
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1x4", 1x6" or 1x8" wafer, or pieces | ||||||||||||||||
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
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Fiji 3 ALD fiji3 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
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Flexus 2320 Stress Tester stresstest |
All |
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1 | ||||||||||||||||
Headway Manual Resist Spinner headway2 |
All |
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one piece or wafer | ||||||||||||||||
Heidelberg MLA 150 heidelberg |
All |
|
405 nm |
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1 | ||||||||||||||
Heidelberg MLA 150 - 2 heidelberg2 |
All |
|
375 nm |
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1 | ||||||||||||||
HMDS Vapor Prime Oven, YES yes |
All |
150 ºC
|
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Karl Suss MA-6 Contact Aligner karlsuss2 |
All |
|
365 nm or 405 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Karl Suss MA-6 Contact Aligner karlsuss |
All |
|
365 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Keyence Digital Microscope VHX-6000 keyence |
All |
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Lakeshore Hall Measurement System LakeshoreHall |
All |
100.00 μm -
1000.00 μm
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 piece | ||||||||||||
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
All | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 wafer(2" to 8") | ||||||||||||||
Lesker Sputter lesker-sputter |
Flexible |
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1 4 inch wafer, 1 6 inch wafer | ||||||||||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
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one 4 inch wafer, one 6 inch wafer | ||||||||||||||
micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
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1x4" wafer | ||||||||||||||||
Nanospec 210XP nanospec2 |
All |
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