For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
Bakes wafers after resist coating.
Bakes wafers with resist after the development, called post-bake.
500Å to 300µm
Convection in N2. Cure. Programmable.
CO2 drying after release of micromachined devices
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
3 Probe Heads for different cleanliness groups.
Pieces need a carrier wafer; Isotropic Etching
