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4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort descending Notes
Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO
Tystar LPCVD Tube Training Flexible SNF Cleanroom Paul G Allen L107
Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Cleanroom Paul G Allen L107

Resist should have been removed

Wet Bench Clean 1
wbclean-1
Wet Bench Clean1and2 Training Clean SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Oven (White)
white-oven
White Oven Training Flexible SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All SNF Cleanroom Paul G Allen L107

3 Probe Heads for different cleanliness groups.

Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Cleanroom Paul G Allen L107
Tystar Bank 3 Tube 11 TEOS
B3T11 Clean TEOS
Tystar LPCVD Tube Training Clean SNF Cleanroom Paul G Allen L107
Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

MRC Reactive Ion Etcher
mrc
MRC Reactive Ion Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode

Oven BlueM 200°C to 430°C
bluem
Blue M Oven Training Flexible SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Tystar Bank 2 Tube 8 LTO
B2T8 Clean LTO
Tystar LPCVD Tube Training Clean SNF Cleanroom Paul G Allen L107
Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Gasonics Aura Asher
gasonics
Resist Removal Dry Gasonics Training Clean, Semiclean SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.

Oven 110°C post-bake
oven110
Resist Postbake Oven 110°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

AJA2 Evaporator
aja2-evap
Evaporator AJA2 Training Flexible SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance

Fiji 2 ALD
fiji2
ALD Fiji 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107
Wet Bench CMOS Metal
wbclean3
Wet Bench CMOS Metal (wbclean3) Training Semiclean SNF Cleanroom Paul G Allen L107

Al, Ti, or W wet etching or oxide etching

Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Gasonics Aura Asher
gasonics
Clean, Semiclean
25
Headway 3 Manual Resist Spinner
headway3
All 1 piece or wafer
Headway Manual Resist Spinner
headway2
All ,
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one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm ,
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1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm ,
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1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
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Intlvac Evaporator
Intlvac_evap
Clean, Semiclean
0.00 - 0.50 μm
,
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12 4 inch wafers, 2 6 inch wafers
Karl Suss MA-6 Contact Aligner
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
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Karl Suss MA-6 Contact Aligner
karlsuss2
All
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
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Keyence Digital Microscope VHX-6000
keyence
All ,
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Lam Research TCP 9400 Poly Etcher
lampoly
Clean, Semiclean
,
25
Laurell Manual Resist Spinner
laurell-R
All
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All 8 in wafer

Sensor Transducer Size is 14 mm diameter 

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1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible ,
,
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,
,
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1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1.00 μm
°C - 800 °C
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one 4 inch wafer, one 6 inch wafer
Matrix Plasma Resist Strip
matrix
Flexible
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25
micromanipulator6000 IV-CV probe station
micromanipulator6000
All ,
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1x4" wafer
MRC Reactive Ion Etcher
mrc
Flexible 1
MVD
mvd
Flexible
1.00 Å - 50.00 nm
24 °C - 150 °C
Nanospec 210XP
nanospec2
All ,
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,

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