| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Resist | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Aixtron MOCVD - III-N system aix-ccs |
Clean (MOCVD) |
0.00 -
5.00 μm
|
400 °C - 1300 °C
|
4"x1, 2"X3, pieces | ||||||||||||||
|
AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces | |||||||||||||||
|
Critical Point Dryer Tousimis Automegasamdri-936 cpd |
Flexible | |||||||||||||||||
|
DISCO Wafer Saw DISCO wafersaw |
Flexible | 1x4", 1x6" or 1x8" wafer, or pieces | ||||||||||||||||
|
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
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|
Headway Manual Resist Spinner headway2 |
"All" | one piece or wafer | ||||||||||||||||
|
Heidelberg MLA 150 heidelberg |
"All" |
|
405 nm | 1 | ||||||||||||||
|
Heidelberg MLA 150 - 2 heidelberg2 |
"All" |
|
375 nm | 1 | ||||||||||||||
|
Heidelberg3 heidelberg3 |
"All" | 1 | ||||||||||||||||
|
Lakeshore Hall Measurement System LakeshoreHall |
"All" |
100.00 μm -
1000.00 μm
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
1 piece | ||||||||||||
|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
"All" | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
1 wafer(2" to 8") | ||||||||||||||
|
Lesker Sputter lesker-sputter |
Flexible | 1 4 inch wafer, 1 6 inch wafer | ||||||||||||||||
|
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
one 4 inch wafer, one 6 inch wafer | ||||||||||||||
|
Micromanipulator6000 IV-CV probe station micromanipulator6000 |
"All" | 1x4" wafer | ||||||||||||||||
|
Oven 110°C post-bake oven110 |
"All" |
110 ºC
|
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|
Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Flexible |
0 °C - 40 °C
|
1 | |||||||||||||||
|
Oxford Plasma Pro PECVD Ox-PECVD |
Semiclean, Flexible |
100.00 Å -
4.00 μm
|
200 °C - 350 °C
|
1 | ||||||||||||||
|
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible | |||||||||||||||||
|
PlasmaTherm Shuttlelock PECVD System ccp-dep |
"All" |
100.00 Å -
4.00 μm
|
100 °C - 350 °C
|
4 | ||||||||||||||
|
Probe Station P200L Probe Station P200L |
"All" | 1 |