Isotropic Si etching; can be used for backside Si removal on small pieces
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Wet Resist Removal: SRS-100 or PRS1000
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Manual solvent cleaning, hot plate
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning of substrates or resist removal.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Automatic Resist spinning and bake
Automatic development.
Pieces need a carrier wafer; Isotropic Etching
non contact 3D optical profiling