Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Resist | Developer | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xactix Xenon Difluoride Etcher xactix |
All |
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1 | |||||||||||
Woollam woollam |
All |
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1 | |||||||||||
Wet Bench Solvent Lithography lithosolv |
Flexible |
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Wet Bench Miscellaneous wbmiscres |
Flexible |
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Wet Bench Flexible Solvents 2 wbflexsolv-2 |
Flexible |
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Wet Bench Flexible Solvents 1 wbflexsolv-1 |
Flexible |
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Wet Bench Flexible Solvents wbflexsolv |
Flexible |
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Wet Bench Flexcorr 2 wbflexcorr-2 |
Flexible |
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Wet Bench Flexcorr 1 wbflexcorr-1 |
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Flexible |
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Tencor P2 Profilometer p2 |
Clean, Semiclean |
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1 | |||||||||||
SVG Resist Coat Track 2 svgcoat2 |
All |
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25 4 inch wafers | |||||||||||
SVG Resist Coat Track 1 svgcoat |
All |
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25 4 inch wafers | |||||||||||
SVG Develop Track 2 svgdev2 |
All |
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25 4 inch wafers | |||||||||||
SVG Develop Track 1 svgdev |
All |
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25 4 inch wafers | |||||||||||
SPTS uetch vapor etch uetch |
All |
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1 | |||||||||||
Sensofar S-neox s-neox |
All |
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1 | |||||||||||
SEM -Zeiss Merlin sem-merlin |
All |
0.00 mm -
35.00 mm
|
6 in wafer |
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Samco PC300 Plasma Etch System samco |
Flexible |
20 ºC
|
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Four 4" wafers or two 6" wafers and one 8" wafer | ||||||||||
Prometrix Resistivity Mapping System prometrix |
All |
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1 | |||||||||||
Profilometer AlphaStep D-300 alphastep2 |
Flexible |
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1 |