Skip to content Skip to navigation

4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

Subscribe to
Equipment name & NEMO ID Training Required & Chargessort descending Cleanliness Location Notes
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasmaetch PE-50
plasma-etch
Plasmaetch PE-50 Training Flexible SNF Exfab Paul G Allen 155 Mavericks

Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All SNF Cleanroom Paul G Allen L107

3 Probe Heads for different cleanliness groups.

Sinton Lifetime Tester
sinton-lifetime-tester
Sinton Lifetime Tester Training Flexible SNF Exfab Paul G Allen 151 Ocean
SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible SNF Exfab Paul G Allen 104 Stinson

Manual development of resist in beakers. SNF approved developers only. No solvents!

Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible SNF Exfab Paul G Allen 104 Stinson
Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Cleanroom Paul G Allen L107

Resist should have been removed

Wet Bench Clean_res-hf
wbclean_res-hf
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Cleanroom Paul G Allen L107

Resist as mask allowed

Wet Bench Clean_res-piranha
wbclean_res-piranha
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Cleanroom Paul G Allen L107

Resist will be removed

Wet Bench CMOS Metal
wbclean3
Wet Bench CMOS Metal (wbclean3) Training Semiclean SNF Cleanroom Paul G Allen L107

Al, Ti, or W wet etching or oxide etching

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Wet Bench Flexcorr 4
wbflexcorr-4
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Pages

Equipment name & NEMO ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Nanospec 3
nanospec3
All
Optomec Printer
optomec-printer
Flexible
Oven (White)
white-oven
Flexible
0 °C - 200 °C
,
,
,
,
,
,
,
,
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Oven 90°C prebake
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
Oxford III-V etcher
Ox-35
Flexible
1
Oxford Plasma Pro ICP-RIE
Ox-gen
Clean
-10 °C - 60 °C
,
,
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible Multiple
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100.00 Å - 4.00 μm
100 °C - 350 °C
,
,
,
,
,
,
,
,
4
PlasmaTherm Versaline HDP CVD System
hdpcvd
All
500.00 Å - 4.00 μm
50 °C - 150 °C
1
Profilometer Alphastep 500
alphastep
Flexible ,
,
,
,
,
,
,
,
1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
1
Prometrix Resistivity Mapping System
prometrix
All ,
,
,
,
,
,
,
,
1
RTA AllWin 610
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer

Pages