Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Bakes wafers with resist after the development, called post-bake.
Bakes wafers after resist coating.
Convection in N2. Cure. Programmable.
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
500Å to 300µm
3 Probe Heads for different cleanliness groups.
non contact 3D optical profiling
Pieces need a carrier wafer; Isotropic Etching
Automatic development.
