Fiji 1 ALD fiji1 |
ALD Fiji 1 and 2 Training |
Semiclean |
SNF Paul G Allen L107 Cleanroom |
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Aixtron MOCVD - III-N system aix-ccs |
MOCVD - III-N Aixtron training |
Clean (MOCVD) |
SNF MOCVD Paul G Allen 213XA |
N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2. |
RTA AllWin 610 aw610_l |
AllWin 610 RTA Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
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AMAT Centurion Epitaxial System epi2 |
Epitaxial AMAT Centurion Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr |
Gasonics Aura Asher gasonics |
Resist Removal Dry Gasonics Training |
Clean, Semiclean |
SNF Paul G Allen L107 Cleanroom |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps. |
Lam Research TCP 9400 Poly Etcher lampoly |
Lam Research TCP 9400 Poly Etcher Training |
Clean, Semiclean |
SNF Paul G Allen L107 Cleanroom |
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides. |
Wet Bench Clean_res-hf wbclean_res-hf |
Wet Bench Clean Piranha/HF/Phosphoric Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
Resist as mask allowed |
Wet Bench Clean_res-piranha wbclean_res-piranha |
Wet Bench Clean Piranha/HF/Phosphoric Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
Resist will be removed |
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Wet Bench Clean Piranha/HF/Phosphoric Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
Resist should have been removed |
Wet Bench CMOS Metal wbclean3 |
Wet Bench CMOS Metal (wbclean3) Training |
Semiclean |
SNF Paul G Allen L107 Cleanroom |
Al, Ti, or W wet etching or oxide etching |
Wet Bench Resist Strip wbresstrip-1 |
Wet Bench Resist Strip |
Clean (Ge), Semiclean, Flexible |
SNF Paul G Allen L107 Cleanroom |
Wet Resist Removal: SRS-100 or PRS1000 |
Wet Bench Decontamination wbdecon |
Wet Bench Decontamination Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
KOH or wafersaw or post-cmp decontamination |
Lesker2 Sputter lesker2-sputter |
Sputter Lesker 1&2 Training |
Semiclean |
SNF Paul G Allen L107 Cleanroom |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean1and2 Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
No resist allowed. Resist should have been removed at the wbclean_res-piranha. |
Wet Bench Clean 2 wbclean-2 |
Wet Bench Clean1and2 Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
No resist allowed. Resist should have been removed at the wbclean_res-piranha |
Tystar Bank 2 Tube 5 B2T5 Clean Anneal |
Tystar Atmospheric Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
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Tystar Bank 2 Tube 6 B2T6 Clean Oxide |
Tystar Atmospheric Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
|
Tystar Bank 3 Tube 9 B3T9 Clean Oxide |
Tystar Atmospheric Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
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Tystar Bank 3 Tube 11 TEOS B3T11 Clean TEOS |
Tystar LPCVD Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
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Tystar Bank 2 Tube 8 LTO B2T8 Clean LTO |
Tystar LPCVD Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
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