The following is a list of equipment where 4 inch round substrates are allowed.
Direct Write
Resist will be removed
Spray coating of resists
N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Automatic Resist spinning and bake
3 Probe Heads for different cleanliness groups.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.