The following is a list of equipment where 4 inch round substrates are allowed.
Automatic development.
Restricted to non-conductive films only
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
1:1 Contact Aligner. Backside align.
Reactor located inside glovebox
Wet Resist Removal: SRS-100 or PRS1000
Isotropic Si etching; can be used for backside Si removal on small pieces
1:1 Contact Aligner. Backside align, including IR.
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.