|
Prometrix Resistivity Mapping System |
|
|
|
3 Probe Heads for different cleanliness groups.
|
Finetech Lambda
flipchipbonder |
Flip Chip Bonder Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
|
Profilometer AlphaStep D-300
alphastep2 |
AlphaStep2 Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
|
Nanospec 210XP
nanospec2 |
Nanospec Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
|
Profilometer Alphastep 500
alphastep |
Alphastep 500 Profilometer Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
500Å to 300µm
|
Heidelberg3
heidelberg3 |
Heidelberg Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
|
Keyence Digital Microscope VHX-6000
keyence |
Microscope Keyence Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
|
Heidelberg MLA 150
heidelberg |
Heidelberg Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
Direct Write |
SEM -Zeiss Merlin
sem-merlin |
SEM-Merlin Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
|
Fiji 2 ALD
fiji2 |
ALD Fiji 1 and 2 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Critical Point Dryer Tousimis Automegasamdri-936
cpd |
Critical Point Dryer Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
CO2 drying after release of micromachined devices |
Savannah ALD
savannah |
ALD Savannah Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Matrix Plasma Resist Strip
matrix |
Matrix Plasma Resist Strip Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
Oxford Plasma Pro ICP-RIE ALE
Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Woollam
woollam |
Woollam Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
|
Xactix Xenon Difluoride Etcher
xactix |
Xactix Xenon Difluoride Etcher Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Isotropic Si etching; can be used for backside Si removal on small pieces |
Sensofar S-neox
s-neox |
Sensofar S-neox Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
non contact 3D optical profiling |
Oxford Plasma Pro PECVD
Ox-PECVD |
Oxford Plasma Pro PECVD Training |
Semiclean, Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Oxford Dielectric Etcher
oxford-rie |
Oxford Dielectric Etcher Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Headway Manual Resist Spinner
headway2 |
Resist Coat (manual) Headway Manual Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists |
