Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Resist | Developer | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SEM -Zeiss Merlin sem-merlin |
"All" |
0.00 mm -
35.00 mm
|
6 in wafer |
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one | |||||||||
Sensofar S-neox s-neox |
"All" |
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1 | |||||||||||
SPTS uetch vapor etch uetch |
"All" |
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1 | |||||||||||
SVG Develop Track 1 svgdev |
"All" |
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25 4 inch wafers | |||||||||||
SVG Develop Track 2 svgdev2 |
"All" |
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25 4 inch wafers | |||||||||||
SVG Resist Coat Track 1 svgcoat |
"All" |
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25 4 inch wafers | |||||||||||
SVG Resist Coat Track 2 svgcoat2 |
"All" |
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25 4 inch wafers | |||||||||||
Wet Bench Flexcorr 1 wbflexcorr-1 |
|
Flexible |
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Wet Bench Flexcorr 2 wbflexcorr-2 |
Flexible |
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Wet Bench Flexcorr 3 wbflexcorr-3 |
Flexible |
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Wet Bench Flexible Solvents wbflexsolv |
Flexible |
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Wet Bench Flexible Solvents 1 wbflexsolv-1 |
Flexible |
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Wet Bench Flexible Solvents 2 wbflexsolv-2 |
Flexible |
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Wet Bench Miscellaneous wbmiscres |
Flexible |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
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25 4 inch wafers | ||||||||||
Wet Bench Solvent Lithography lithosolv |
Flexible |
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Woollam woollam |
"All" |
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1 | |||||||||||
Xactix Xenon Difluoride Etcher xactix |
"All" |
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1 |