Inductively Coupled Plasma Etching (ICP) |
Oxford III-V etcher Ox-35 |
Ox-35 is an ICP-RIE etch system configured for the etching of III-V materils and Si.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Inductively Coupled Plasma Etching (ICP) |
Lam Research TCP 9400 Poly Etcher lampoly |
Lam 9400 TCP Poly Etcher ; Clean category; for poly and Si etches; maximum etch depth 3um.
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Clean, Semiclean |
SNF Cleanroom Paul G Allen L107 |
Inductively Coupled Plasma Etching (ICP) |
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
PT-MTL is an ICP-RIE etch system configured for the etching of silicon oxide and deep glass/quartz etching.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Silicon Nitride Wet Etching, Wet Chemical Processing |
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Semi-automated wet bench for etching silicon nitride from 3", 4", and 6" Si, SiGe, and quartz substrates using 155C phosphoric acid. The baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.
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Clean |
SNF Cleanroom Paul G Allen L107 |
Vapor Etching |
SPTS uetch vapor etch uetch |
The SPTS uetch vapor system uses anhydrous HF and ethanol at reduced pressure and 45C to etch isotropically sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices.
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All |
SNF Cleanroom Paul G Allen L107 |
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Magnetically Enhanced RIE (MERIE) |
AMAT P5000 Etcher p5000etch |
P5000 is a magnetically enhanced reactive ion etching system (MERIE) for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.). P5000 is currently classified as CMOS restricted.
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Clean, Clean (Ge), Semiclean |
SNF Cleanroom Paul G Allen L107 |
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 2 wbflexcorr-2 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Dry Resist Removal, Dry Etching |
Technics Asher technics |
Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing |
Wet Bench CMOS Metal wbclean3 |
Wet bench part of semiclean cleanliness group to etch Al, Ti, W, or silicon oxide from 3, 4, or 6 inch wafers. The tanks can hold up to 25 wafers.
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Semiclean |
SNF Cleanroom Paul G Allen L107 |
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal |
Samco PC300 Plasma Etch System samco |
The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Clean_res-hf wbclean_res-hf |
Semi-automated wet bench for etching oxide from 3", 4", and 6" Si, SiGe, and quartz substrates using 50:1 HF, 6:1BOE, or 20:1BOE. 2 baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.
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Clean |
SNF Cleanroom Paul G Allen L107 |
Inductively Coupled Plasma Etching (ICP) |
Oxford Plasma Pro ICP-RIE Ox-gen |
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Clean |
SNF Cleanroom Paul G Allen L107 |
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 4 wbflexcorr-4 |
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing |
Wet Bench Flexcorr 3 wbflexcorr-3 |
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Reactive Ion Etching (RIE) |
MRC Reactive Ion Etcher mrc |
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including metals, oxides, nitrides, silicons, and some organic films.
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Gasonics Aura Asher gasonics |
The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group.
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Clean, Semiclean |
SNF Cleanroom Paul G Allen L107 |
Inductively Coupled Plasma Etching (ICP) |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
PT-MTL is an ICP-RIE etch system configured for the etching of metals and metal-based compounds with volatile bi-products
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Matrix Plasma Resist Strip matrix |
The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen).
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Flexible |
SNF Cleanroom Paul G Allen L107 |
Vapor Etching |
Xactix Xenon Difluoride Etcher xactix |
The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher.
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All |
SNF Cleanroom Paul G Allen L107 |