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Silicon Germanium

Chemical Formula: 
SiGe
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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort ascending Notes
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks
AJA Evaporator
aja-evap
Evaporator AJA training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Lesker Sputter
lesker-sputter
Sputter Lesker 1&2 Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training "All" SNF Exfab Paul G Allen 151 Ocean
Lakeshore Hall Measurement System
LakeshoreHall
Lakeshore Hall Measurement System training "All" SNF Exfab Paul G Allen 151 Ocean
micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training "All" SNF Exfab Paul G Allen 151 Ocean
Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Oven 90°C prebake
oven90
Resist Prebake Oven 90°C Training "All" SNF Paul G Allen L107 Cleanroom

Bakes wafers after resist coating.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training "All" SNF Paul G Allen L107 Cleanroom

Automatic development.

Tystar Bank 3 Tube 12 Poly
B3T12 Clean Poly
Tystar LPCVD Tube Training Clean SNF Paul G Allen L107 Cleanroom
Headway Manual Resist Spinner
headway2
Resist Coat (manual) Headway Manual Training "All" SNF Paul G Allen L107 Cleanroom

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual solvent cleaning of substrates or resist removal.

Karl Suss MA-6 Contact Aligner
karlsuss2
Contact Aligner Karl Suss MA-6 Training "All" SNF Paul G Allen L107 Cleanroom

1:1 Contact Aligner.
Backside align.

Tystar Bank 3 Tube 10 Nitride
B3T10 Clean Nitride
Tystar LPCVD Tube Training Clean SNF Paul G Allen L107 Cleanroom
Critical Point Dryer Tousimis Automegasamdri-936
cpd
Critical Point Dryer Training Flexible SNF Paul G Allen L107 Cleanroom

CO2 drying after release of micromachined devices

Karl Suss MA-6 Contact Aligner
karlsuss
Contact Aligner Karl Suss MA-6 Training "All" SNF Paul G Allen L107 Cleanroom

1:1 Contact Aligner.
Backside align, including IR.

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training "All" SNF Paul G Allen L107 Cleanroom

Direct Write

Tystar Bank 2 Tube 7 Nitride
B2T7 Flexible Nitride
Tystar LPCVD Tube Training Flexible SNF Paul G Allen L107 Cleanroom
PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training "All" SNF Paul G Allen L107 Cleanroom

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Wet Bench Clean 1
wbclean-1
Wet Bench Clean1and2 Training Clean SNF Paul G Allen L107 Cleanroom

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

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Equipment name & NEMO ID Technique Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
AJA Evaporator
aja-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
ASML PAS 5500/60 i-line Stepper
asml
"All"
365 nm 5 inch
,
,
,
,
CHA Solutions II Evaporator
cha-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
4"x15 or 6"x3 wafers or pieces
Critical Point Dryer Tousimis Automegasamdri-936
cpd
Flexible
,
,
,
,
,
,
,
,
,
EVG 101 Spray Coater
evgspraycoat
"All" ,
,
,
,
1
Fiji 1 ALD
fiji1
Semiclean
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Fiji 2 ALD
fiji2
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Fiji 3 ALD
fiji3
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Finetech Lambda
flipchipbonder
Flexible
°C - 400 °C
,
,
,
,
,
1
Flexus 2320 Stress Tester
stresstest
"All" ,
,
,
,
,
,
,
,
1
Headway Manual Resist Spinner
headway2
"All" ,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
"All"
405 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
"All"
375 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
"All"
150 ºC
,
,
,
,
,
,
,
,
Intlvac Evaporator
Intlvac_evap
Clean, Semiclean
0.00 - 0.50 μm
,
,
12 4 inch wafers, 2 6 inch wafers
Karl Suss MA-6 Contact Aligner
karlsuss
"All"
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner
karlsuss2
"All"
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,
Keyence Digital Microscope VHX-6000
keyence
"All" ,
,
,
,
,
,
,
,
Lakeshore Hall Measurement System
LakeshoreHall
"All"
100.00 μm - 1000.00 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
1 piece

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