PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training |
All |
SNF Cleanroom Paul G Allen L107 |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
|
Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean1and2 Training |
Clean |
SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha.
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EVG Contact Aligner evalign |
Contact Aligner EVG Training |
All |
SNF Cleanroom Paul G Allen L107 |
1:1 Contact Aligner.
Anodic Bond, backside align, including IR.
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Heidelberg MLA 150 - 2 heidelberg2 |
Heidelberg Training |
All |
SNF Cleanroom Paul G Allen L107 |
Direct Write
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Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride |
Tystar LPCVD Tube Training |
Clean |
SNF Cleanroom Paul G Allen L107 |
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Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Wet Bench Clean Piranha/HF/Phosphoric Training |
Clean |
SNF Cleanroom Paul G Allen L107 |
Resist should have been removed
|
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
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RTA AllWin 610 aw610_r |
AllWin 610 RTA Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
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Technics Asher technics |
Technics Asher Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
|
Tystar Bank 2 Tube 7 Nitride B2T7 Clean Nitride |
Tystar LPCVD Tube Training |
Clean |
SNF Cleanroom Paul G Allen L107 |
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Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
|
Xactix Xenon Difluoride Etcher xactix |
Xactix Xenon Difluoride Etcher Training |
All |
SNF Cleanroom Paul G Allen L107 |
Isotropic Si etching; can be used for backside Si removal on small pieces
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RTA AllWin 610 aw610_l |
AllWin 610 RTA Training |
Clean |
SNF Cleanroom Paul G Allen L107 |
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Tystar Bank 1 Tube 4 LTO B1T4 Flexible LTO |
Tystar LPCVD Tube Training |
Flexible |
SNF Cleanroom Paul G Allen L107 |
|
micromanipulator6000 IV-CV probe station micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training |
All |
SNF Exfab Paul G Allen 151 Ocean |
|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
LEI1500 Contactless Sheet Resistance Mapping Training |
All |
SNF Exfab Paul G Allen 151 Ocean |
|
Lakeshore Hall Measurement System LakeshoreHall |
Lakeshore Hall Measurement System training |
All |
SNF Exfab Paul G Allen 151 Ocean |
|
DISCO Wafer Saw DISCO wafersaw |
Wafersaw DISCO training |
Flexible |
SNF Exfab Paul G Allen 159 Capitola |
|
AJA Evaporator aja-evap |
Evaporator AJA training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
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Lesker Sputter lesker-sputter |
Sputter Lesker 1&2 Training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
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