ASML PAS 5500/60 i-line Stepper asml |
Stepper ASML PAS 5500/60 i-line Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
5:1 reducing stepper |
Technics Asher technics |
Technics Asher Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Tystar Bank 2 Tube 7 Nitride B2T7 Flexible Nitride |
Tystar LPCVD Tube Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean1and2 Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
No resist allowed. Resist should have been removed at the wbclean_res-piranha. |
RTA AllWin 610 aw610_r |
AllWin 610 RTA Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Tystar Bank 1 Tube 4 LTO B1T4 Flexible LTO |
Tystar LPCVD Tube Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Wet Bench Clean Piranha/HF/Phosphoric Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
Resist should have been removed |
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
RTA AllWin 610 aw610_l |
AllWin 610 RTA Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
|
Samco PC300 Plasma Etch System samco |
Samco Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Tystar Bank 3 Tube 11 TEOS B3T11 Clean TEOS |
Tystar LPCVD Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
|
Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |
Xactix Xenon Difluoride Etcher xactix |
Xactix Xenon Difluoride Etcher Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Isotropic Si etching; can be used for backside Si removal on small pieces |
Lesker2 Sputter lesker2-sputter |
Sputter Lesker 1&2 Training |
Semiclean |
SNF Paul G Allen L107 Cleanroom |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Tystar Bank 2 Tube 8 LTO B2T8 Clean LTO |
Tystar LPCVD Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
|
Probe Station P200L Probe Station P200L |
Probe Station P200L Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
|
Micromanipulator6000 IV-CV probe station micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
LEI1500 Contactless Sheet Resistance Mapping Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
|
Lakeshore Hall Measurement System LakeshoreHall |
Lakeshore Hall Measurement System training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
|