| Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Aixtron Black Magic graphene CVD furnace aixtron-graphene |
Flexible |
800 °C - 1100 °C
|
1x4" wafer or Copper/Nickel foil | |||||||||||
|
AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces | |||||||||||
|
AJA2 Evaporator aja2-evap |
Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces | |||||||||||
|
CHA Solutions II Evaporator cha-evap |
Flexible |
0.00 -
300.00 nm
|
4"x15 or 6"x3 wafers or pieces | |||||||||||
|
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
|||||||||||
|
Heidelberg3 heidelberg3 |
"All" | 1 | ||||||||||||
|
KLA-Rapier Deep Reactive Ion Etcher KLA-DSE |
Pre-Diffusion Clean | Clean |
-10 °C - 40 °C
|
No through etch on full wafers. Stop 100microns before the through etch and use carrier wafer | ||||||||||
|
Lakeshore Hall Measurement System LakeshoreHall |
"All" |
100.00 μm -
1000.00 μm
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
1 piece | ||||||||
|
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
"All" | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
1 wafer(2" to 8") | ||||||||||
|
Micromanipulator6000 IV-CV probe station micromanipulator6000 |
"All" | 1x4" wafer | ||||||||||||
|
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible | |||||||||||||
|
Probe Station P200L Probe Station P200L |
"All" | 1 | ||||||||||||
|
Samco PC300 Plasma Etch System samco |
Flexible |
20 ºC
|
Four 4" wafers or two 6" wafers and one 8" wafer | |||||||||||
|
Savannah ALD savannah |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 250 °C
|
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|
Woollam woollam |
"All" | 1 |