Deposition covers a wide variety of methods that are used to add a wide variety of materials. The subcategories here can be useful to help narrow down your search.

  • Atomic Layer Deposition (ALD) is used to deposit less than 50nm of highly conformal films.
  • Chemical Vapor Deposition (CVD) is used to deposit films less than 5μm thick, carbon nanotubes, and graphene.
  • Deposited III-N uses a type of CVD called MOCVD to deposit the nitrides of materials that are found in group III of the periodic table.
  • Deposited III-V uses a type of CVD called MOCVD to deposit combinations of materials from group III and group V of the periodic table.
  • Ink lists the equipment that can be used to print inks that are either commercially available or made by the user.
  • Physical Vapor Deposition (PVD) is used to deposit primarily metal layers as well as some dielectrics.
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
Plasma Enhanced (PE) ALD Fiji 1 ALD
fiji1

Fiji1 is a load-locked, plasma-enabled atomic layer deposition (ALD) system.

 Semiclean SNF Paul G Allen L107 Cleanroom
Graphene CVD Growth Aixtron Black Magic graphene CVD furnace
aixtron-graphene 		Flexible SNF Exfab Paul G Allen L119 Año Nuevo
Plasma Enhanced (PE) ALD Fiji 2 ALD
fiji2

Fiji2 is a load-locked, plasma-enabled atomic layer deposition (ALD) system. Fiji2 is currently classified as Flexible and is open to a wide range of metals and dielectrics.

 Flexible SNF Paul G Allen L107 Cleanroom
Thermal ALD Savannah ALD
savannah 		Flexible SNF Paul G Allen L107 Cleanroom
Deposition PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater 		Flexible SNF Exfab Paul G Allen 155 Mavericks
Patterning, Ink Voltera
voltera 		Flexible SNF Exfab Paul G Allen 151 Ocean
Evaporation Intlvac Evaporator
Intlvac_evap 		Flexible SNF Paul G Allen L107 Cleanroom
Ink Fujifilm Dimatix Ink Jet Printer
nanoinkjet 		Flexible SNF Exfab Paul G Allen 155 Mavericks
Sputtering Hummer V Sputter Coater
hummer 		Flexible SNF Exfab Paul G Allen L104 Stinson
Ink Optomec Printer
optomec-printer 		Flexible SNF Exfab Paul G Allen 155A Venice
Deposition PDMS Workbench Flexible SNF Exfab Paul G Allen 155 Mavericks
Low Pressure (LP) CVD Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly

LPCVD of Poly silicon, Amorphous Silicon, Doped Silicon, Silicon-Germanium.

 Flexible SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 3 Tube 12 Poly
B3T12 Clean Poly

LPCVD of Poly silicon, Amorphous Silicon, Doped Silicon.

 Clean SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 3 Tube 10 Nitride
B3T10 Clean Nitride

LPCVD of Silicon Nitride, Stoichiometric silicon nitride, low-stress silicon nitride, Silicon Oxy Nitride.

 Clean SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 2 Tube 7 Nitride
B2T7 Flexible Nitride

LPCVD of Stoichiometric silicon nitride, low-stress silicon nitride, Silicon Oxy Nitride.

 Flexible SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO

LPCVD of  Low Temperatur Oxide, PSG, BSG, BPSG.

 Flexible SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 3 Tube 11 TEOS
B3T11 Clean TEOS

LPCVD of TEOS Oxide.

 Clean SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 2 Tube 8 LTO
B2T8 Clean LTO

LPCVD of  Low Temperatur Oxide, PSG, BSG, BPSG.

 Clean SNF Paul G Allen L107 Cleanroom
Plasma Enhanced (PE) CVD Oxford Plasma Pro PECVD
Ox-PECVD

Ox-PECVD is dual frequnency plasma deposition system that can do silicon dioxide, amorphous, Oxynitride, silicon carbide and multi stress Nitride. 

 Semiclean, Flexible SNF Paul G Allen L107 Cleanroom
Evaporation AJA Evaporator
aja-evap 		Flexible SNF Exfab Paul G Allen 155A Venice

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