4 inch wafer

Short Name:

4"

The following is a list of equipment where 4 inch round substrates are allowed.

Equipment Tables

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Oxford Dielectric Etcher oxford-rie	Oxford Dielectric Etcher Training	Flexible	SNF Paul G Allen L107 Cleanroom	4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
RTA AllWin 610 aw610_r	AllWin 610 RTA Training	Flexible	SNF Paul G Allen L107 Cleanroom
Oxford Plasma Pro ICP-RIE Ox-gen	Ox-gen etcher Training	Flexible	SNF Paul G Allen L107 Cleanroom
Wet Bench Flexible Solvents 1 wbflexsolv-1	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning, two ultrasonic baths.
Lam Research TCP 9400 Poly Etcher lampoly	Lam Research TCP 9400 Poly Etcher Training	Clean, Semiclean	SNF Paul G Allen L107 Cleanroom	Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
RTA AllWin 610 aw610_l	AllWin 610 RTA Training	Clean	SNF Paul G Allen L107 Cleanroom
Tystar Bank 1 Tube 3 Poly B1T3 Flexible Poly	Tystar LPCVD Tube Training	Flexible	SNF Paul G Allen L107 Cleanroom
Headway Manual Resist Spinner headway2	Resist Coat (manual) Headway Manual Training	"All"	SNF Paul G Allen L107 Cleanroom	Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Wet Bench Flexible Solvents 2 wbflexsolv-2	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning, hot plate
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox	Plasma Therm Versaline LL ICP Dielectric Etcher Training	Flexible	SNF Paul G Allen L107 Cleanroom	Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Tystar Bank 3 Tube 12 Poly B3T12 Clean Poly	Tystar LPCVD Tube Training	Clean	SNF Paul G Allen L107 Cleanroom
Fiji 1 ALD fiji1	ALD Fiji 1 and 2 Training	Semiclean	SNF Paul G Allen L107 Cleanroom
Wet Bench Decontamination wbdecon	Wet Bench Decontamination Training	Clean	SNF Paul G Allen L107 Cleanroom	KOH or wafersaw or post-cmp decontamination
SVG Develop Track 1 svgdev	SVG Resist Develop tracks 1 and 2 Training	"All"	SNF Paul G Allen L107 Cleanroom	Automatic development.
Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride	Tystar LPCVD Tube Training	Clean	SNF Paul G Allen L107 Cleanroom
Oxford III-V etcher Ox-35	Oxford III-V etcher Training	Flexible	SNF Paul G Allen L107 Cleanroom	Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.
Wet Bench Solvent Lithography lithosolv	Lithography Solvent Bench Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Laurell Manual Resist Spinner laurell-R	Laurell Manual Resist Spinner Training	"All"	SNF Paul G Allen L107 Cleanroom	SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
Sensofar S-neox s-neox	Sensofar S-neox Training	"All"	SNF Paul G Allen L107 Cleanroom	non contact 3D optical profiling
Heidelberg MLA 150 - 2 heidelberg2	Heidelberg Training	"All"	SNF Paul G Allen L107 Cleanroom	Direct Write

Pages