The "All" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "All" category.
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Material Thickness Range | Materials Lab Supplied | Exposure Wavelength | Resist | Developer | Process Temperature Range | Gases | Sample Size Limits | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Oven 90°C prebake oven90 |
"All" |
90 ºC
|
||||||||||||
|
PlasmaTherm Shuttlelock PECVD System ccp-dep |
"All" |
100.00 Å -
4.00 μm
|
100 °C - 350 °C
|
4 | ||||||||||
|
PlasmaTherm Versaline HDP CVD System hdpcvd |
"All" |
500.00 Å -
4.00 μm
|
50 °C - 150 °C
|
1 | ||||||||||
|
Probe Station P200L Probe Station P200L |
"All" | 1 | ||||||||||||
|
Prometrix Resistivity Mapping System prometrix |
"All" | 1 | ||||||||||||
|
Reflectance Spectrometer Filmetrics F40 filmetrics |
"All" | one piece or wafer | ||||||||||||
|
SEM -Zeiss Merlin sem-merlin |
"All" |
0.00 mm -
35.00 mm
|
6 in wafer | one | ||||||||||
|
Sensofar S-neox s-neox |
"All" | 1 | ||||||||||||
|
SPTS uetch vapor etch uetch |
"All" | 1 | ||||||||||||
|
SVG Develop Track 1 svgdev |
"All" | 25 4 inch wafers | ||||||||||||
|
SVG Develop Track 2 svgdev2 |
"All" | 25 4 inch wafers | ||||||||||||
|
SVG Resist Coat Track 1 svgcoat |
"All" | 25 4 inch wafers | ||||||||||||
|
SVG Resist Coat Track 2 svgcoat2 |
"All" | 25 4 inch wafers | ||||||||||||
|
Ultraviolet Photoresist Cure uvcure |
"All" | 254 nm | ||||||||||||
|
Woollam woollam |
"All" | 1 | ||||||||||||
|
Xactix Xenon Difluoride Etcher xactix |
"All" | 1 |